Session 1

Space Applications for Analogue and Mixed-Signal ASIC

		A CMOS Instrumentation Chain for Charged Particle Event Detection in the Space Environment  Olivier Bernal, Universite de Toulouse, France
		The Essential Telemetry (ETM) ASIC: A Mixed Signal, Rad-Hard and Low-Power Component for Direct Telemetry Acquisition and Miniaturized RTU Applications George Kottaras, Space-ASICs, Greece
		Reconfigurable System-on-Chip for Multiple Instrumentation Applications Daniel Gonzalez Gutierrez, Arquimea, Spain
		OWLs: A Mixed-Signal ASIC for Optical Wire-Less Links in Space Instruments Juan Ramos-Martos, Instituto de Microelectrónica de Sevilla, Spain
		Model accuracy for a smart power ASIC chip set for Space Daniel Gonzalez Gutierrez, Arquimea, Spain
		Integrated SAR Receiver/Converter for L, C and X-Bands Markku Åberg, VTT, Finland
		Application of an Eight-Channel Comparator in a Cross-Correlator for Synthetic Aperture Radiometry Erik Ryman, Omnisys Instruments, Sweden

Session 2

Methodologies for Radiation Hardening on Analogue Circuits

		Analysis of Single Event Transient Effects in Analogue Topologies Fernando Márquez, University of Seville, Spain
		Mixed-Signal Design Methodology Incorporating A Priori Single Event Transient (SET) Rate Estimates David Kerwin, Aeroflex, UK

Session 3 / 4

Advances in Mixed-Signal Technology

		Development of the ATMEL 150 nm CMOS Technology for Space Bernard Bancelin, Atmel, France
		Radiation Hardened Mixed‐Signal IP with Dare Technology Geert Thys, IMEC, Belgium
		IHPs SiGe BiCMOS technologies for RF and mixed-signal space applications René Scholz, IHP, Germany
		Advanced features in RadSafe TM technology Tuvia Liran, Ramon Chips, Israel
		Advances in Radiation Hardened Mixed‐Signal Technology David Kerwin, Aeroflex, UK
		Technologies for Mixed-Signal Design Laurent Dugoujon, ST Microelectronics, France

Session 5

Radiation Tests and Effects

		Radiation Testing Methodology and Techniques Cesar Boatella Polo, ESA/ESTEC, The Netherlands
		A new laser source for SEE tests Isabel Lopez-Calle, ESA/ESTEC, The Netherlands
		Electrical-Radiation Test Results of VASP and Flight Model Development Plan Philippe Ayzac, Thales Alenia Space, France
		The Road to Parts Approval and the Role of ESCC Fernando Martinez-Martin, ESA/ESTEC, The Netherlands
		Heavy-Ion and Proton Testing of Mixed-Signal ASSPs Rajan Bedi, EADS Astrium, UK
		Radiation Test of TFSMART2 Technology using Extended Common Mode LVDS and DC-DC Converter Components Volodymyr Burkhay, Telefunken Semiconductors, Germany
		Evaluation of the AMS 0.35 um CMOS Technology for Use in Space Applications Juan Ramos-Martos, Instituto de Microelectrónica de Sevilla, Spain
		A Comparitive Study of the MSI and Proba-V Linear Arrays under the Influence of Radiation Jan Vermeiren, Xenics, Belgium

Session 6

Needs and Requirements for Analog and Mixed-Signal ICs for Space

		Analog and Mixed Signal ICs for use in future Space Missions Shri Agarwal, NASA/JPL, USA
		“Smart Microsystems” - A Feasibility Study to investigate the Decentralisation of  Space Systems with highly efficient Micronodes John Cornforth, SEA, UK
		Challenges of Mixed Signal Space Grade ICs operating at Microwave Frequencies Nicolas Chantier, e2v, France
		A Proven Development Flow for Designing Mixed Signal ASICs: Lessons Learnt from ASTRIUM Field Return Matthieu Dollon, Astrium, France
		Barriers to Mixed-Signal Technology Growth in Space Richard Jansen, ESA/ESTEC, The Netherlands
		Wrap-Up and Conclusion Agustín Fernández León

Poster Session

		Design of a Radiation-Hardened Controller Area Network (CAN) Transceiver in 0.35 µm Triple-well CMOS Scott Lindner, ESA/ESTEC, The Netherlands
		“Radiation Enhanced BSIM4 Model for UMC 90 nm Sotirios Athanasiou, ESA/ESTEC, The Netherlands